Chinese Company Issues First $350 Million Tech Innovation Bond Raised in Digital Yuan | Headlines | News | CoinMarketCap

01/29/2024 16:40
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Chinese Company Issues First $350 Million Tech Innovation Bond Raised in Digital Yuan | Headlines | News | CoinMarketCap

A Chinese infrastructure company has successfully raised $350 million in digital yuan for its new technology innovation bond. According to Shanghai Securities News, the Shandong Hi-Speed Group issued the “Shandong Hi-Speed Group Co., Ltd. 2024 Public Offering to Institutional Inv...

Chinese Company Issues First $350 Million Tech Innovation Bond Raised in Digital Yuan

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Published on January 29, 2024 09:27 GMT+00:00edited on January 29, 2024 09:31 GMT+00:00

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